Purification
We operate two kinds of purification processes, tailored to different technical needs in different applications:
Process AE-10
This process is designed for applications demanding a maximum of 10 ppm impurities, measured by the GDMS method.
Typical applications, mainly in the photovoltaic silicon and wafer manufacturing, are:
- DSS components for PV grade silicon smelting
- Components for trichlorosilane reactors
- Components for AR CVD furnaces (batch or inline)
Another important specific of this process is that it can handle parts with length up to 2500 mm and diameters to 2500 mm
Process AE-2
AE-2 has been designed for applications demanding a very low level of impurities below 2 ppm GDMS. Typical applications are in the Semiconductor wafer and chip manufacturing:
- MOCVD Epitaxy
- Epitaxy
- Ion Implantation
- Molecular Beam Epitaxy